WS-302LF
WS-302LF Lead-free Soldering Machine
Equipped with the minimum number of units required for a standard lead-free machine.
Features:
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Soldering quality equivalent to that of Sn/Pb solder can be stably maintained with the outside peel-back point adjustment unit (Optional unit, patent pending). -
The solder bath design is identical to that used for the MDR series machines. A highly durable surface treatment is provided as a standard specification (KANAK treatment).
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Built-in blowers are used for top and bottom cooling in order to improve the cooling efficiency.
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The conveyor fingers are made of resin effective for lead-free solder and the prevention of solder adherence.
WS-302LF
Model
35Wx100L(mm)
300Wx350L (mm)
1.0~2.0(mm)
Processable PCB Size
MAX.
120mm or less
Component Height
4.5" +/- 1"
Approx. 450kg
3-phase 200V 27KVA
Conveyor Angle
Solder Capacity
Power Supply
4~5kg/cm2
Air Source
3200Lx1200Wx1500H(mm)
Dimensions
Approx. 1000kg
Weight
MIN.
Thickness
>
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