WS-302LF

WS-302LF Lead-free Soldering Machine


Equipped with the minimum number of units required for a standard lead-free machine.

Features:

  1. BulletSoldering quality equivalent to that of Sn/Pb solder can be stably maintained with the outside peel-back point adjustment unit (Optional unit, patent pending).

  2. BulletThe solder bath design is identical to that used for the MDR series machines.  A highly durable surface treatment is provided as a standard specification (KANAK treatment).

  3. BulletBuilt-in blowers are used for top and bottom cooling in order to improve the cooling efficiency.

  4. BulletThe conveyor fingers are made of resin effective for lead-free solder and the prevention of solder adherence.

Specifications

WS-302LF

Model

35Wx100L(mm)

300Wx350L (mm)

1.0~2.0(mm)

Processable PCB Size

MAX.

120mm or less

Component Height

4.5" +/- 1"

 Approx. 450kg

3-phase 200V 27KVA

Conveyor Angle

Solder Capacity

Power Supply

4~5kg/cm2

Air Source

3200Lx1200Wx1500H(mm)

Dimensions

Approx. 1000kg

Weight

MIN.

Thickness

>

   Main Menu